Custom graphite susceptors for SiC PVT, MOCVD, epitaxy, and vacuum furnace thermal-field assemblies.
| Metric | Typical Range | Why It Matters |
|---|---|---|
| Thermal Uniformity | Defined by furnace and geometry | Uniform heat transfer reduces process variation across wafer or crucible interfaces. |
| Surface Finish | Reviewed by drawing and wafer contact need | Surface quality affects particle risk, seating, and coating performance. |
Decision fit
Equipment OEMs and process engineers specifying thermal coupling, wafer support, or furnace susceptor geometry.
Primary proof point
Defined by furnace and geometry
Uniform heat transfer reduces process variation across wafer or crucible interfaces.
RFQ trigger
| Decision Gate | What Buyers Should Check | Acceptance Evidence |
|---|---|---|
| Use-case fit | SiC PVT thermal-field coupling; MOCVD and epitaxy wafer support; Vacuum furnace heating assemblies | Application, furnace duty, and buyer-side validation goal are confirmed before material or process route selection. |
| Parameter baseline | Thermal Uniformity: Defined by furnace and geometry; Surface Finish: Reviewed by drawing and wafer contact need | Target ranges, report needs, and pass/fail criteria are written into the RFQ or sample approval plan. |
| Risk closure | Localized hot spots: Align material grade, resistivity expectations, and geometry before machining.; Particle shedding: Specify cleaning, packaging, and optional coating requirements for the process environment. | Drawing notes, inspection scope, cleaning, coating, packaging, and traceability controls are agreed before repeat supply. |
| RFQ completeness | Equipment model or furnace interface drawing; Susceptor CAD, wafer pocket, ring, or support geometry; Graphite grade, density, purity, and coating target; Operating temperature, gas environment, and cleaning constraints | Engineering can return a quote direction without avoidable loops for drawing, purity, coating, quantity, or delivery gaps. |
Confirm furnace duty, drawing revision, target purity, operating atmosphere, and replacement cycle before material selection.
Match isostatic graphite grade, purification depth, coating route, and machining allowance to the process risk.
Machine graphite bodies, lids, rings, heaters, carriers, and insulation interfaces against the approved drawing pack.
Align dimensional checks, purity report format, cleaning, vacuum sealing, cushioning, and crate requirements before shipment.
Review how crucibles, hot-zone parts, and insulation fit a PVT growth workflow.
Check the factory workflow for drawing-based graphite part production.
Align inspection reports, sealing, cushioning, and export crate expectations.
Open the related page to continue technical qualification.
Open the related page to continue technical qualification.
Inquiry Email
Attach DWG, STEP, or PDF drawings and include purity, tolerance, quantity forecast, and delivery country.
Instant Chat
+8618857971991
Use WhatsApp for quick engineering clarification before a formal quote.
Yes. We support custom susceptors, support rings, wafer carriers, and furnace interfaces based on CAD or 2D drawings.
It depends on gas chemistry, temperature, wafer contact, and contamination limits. We review bare graphite, CVD SiC, or TaC routes by application.
