CVD-SiC coated graphite susceptors and wafer carriers for SiC epitaxy, GaN-on-Si MOCVD, LED, and compound semiconductor processing.
| Metric | Typical Range | Why It Matters |
|---|---|---|
| Coating Selection | CVD SiC or TaC by process chemistry | Coating choice affects chemical resistance, particle behavior, and wafer contamination risk. |
| Pocket Geometry | Defined by wafer size and equipment interface | Pocket flatness and edge support influence thermal uniformity and wafer handling repeatability. |
Decision fit
Epitaxy process engineers, equipment maintenance teams, and procurement groups replacing coated graphite wafer carriers by drawing.
Primary proof point
CVD SiC or TaC by process chemistry
Coating choice affects chemical resistance, particle behavior, and wafer contamination risk.
RFQ trigger
| Decision Gate | What Buyers Should Check | Acceptance Evidence |
|---|---|---|
| Use-case fit | SiC homoepitaxy and wafer support; GaN heteroepitaxy and LED MOCVD processes; Replacement susceptors for Aixtron G5/G10, Veeco TurboDisc, LPE PE-106, and AMEC Prismo reactors | Application, furnace duty, and buyer-side validation goal are confirmed before material or process route selection. |
| Parameter baseline | Coating Selection: CVD SiC or TaC by process chemistry; Pocket Geometry: Defined by wafer size and equipment interface | Target ranges, report needs, and pass/fail criteria are written into the RFQ or sample approval plan. |
| Risk closure | Coating pinholes: Define coating route, inspection expectations, cleaning method, and acceptance criteria before sample validation.; Wafer seating variation: Confirm pocket geometry, support points, flatness, and carrier balance against the equipment drawing. | Drawing notes, inspection scope, cleaning, coating, packaging, and traceability controls are agreed before repeat supply. |
| RFQ completeness | Equipment model or chamber interface drawing; Wafer size, pocket count, pocket depth, and flatness requirements; Base graphite grade, coating material, and coating thickness target; Process gases, cleaning chemistry, and maximum operating temperature | Engineering can return a quote direction without avoidable loops for drawing, purity, coating, quantity, or delivery gaps. |
Confirm furnace duty, drawing revision, target purity, operating atmosphere, and replacement cycle before material selection.
Match isostatic graphite grade, purification depth, coating route, and machining allowance to the process risk.
Machine graphite bodies, lids, rings, heaters, carriers, and insulation interfaces against the approved drawing pack.
Align dimensional checks, purity report format, cleaning, vacuum sealing, cushioning, and crate requirements before shipment.
Review how crucibles, hot-zone parts, and insulation fit a PVT growth workflow.
Check the factory workflow for drawing-based graphite part production.
Align inspection reports, sealing, cushioning, and export crate expectations.
Open the related page to continue technical qualification.
Open the related page to continue technical qualification.
Inquiry Email
Attach DWG, STEP, or PDF drawings and include purity, tolerance, quantity forecast, and delivery country.
Instant Chat
+8618857971991
Use WhatsApp for quick engineering clarification before a formal quote.
Yes, we manufacture barrel, pancake, and single-wafer susceptors.
Yes. The equipment model or chamber interface drawing helps confirm wafer pocket geometry, mounting interface, rotation, coating surfaces, and inspection needs.
